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基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

电子工程师 作者:工程师陈翠 2018-06-17 03:57 次阅读

Maxim公司的MAX32625/MAX32626是基于FPU的超低功耗高性能ARM® Cortex®-M4 MCU.该架构包括了超低功耗高效率信号处理功能和容易使用,内部96MHz振荡器提供了高性能,而4MHz振荡器支持需要常开监视功能的最低功耗。器件集成了512KB闪存和160KB SRAM,核电压1.2V,I/O电压1.8V-3.3V,主要用在运动手表,健身监理器,可穿戴医疗贴件,手持医疗设备和传感器集线器。本文介绍了MAX32625/MAX32626主要优势和特性,框图,典型应用电路图以及评估板MAX32625/MAX32626EVK主要优势和特性,框图和电路图。

The MAX32625/MAX32626 are ARM® Cortex®-M4 with FPU-based microcontrollers, ideal for the emerg­ing category of wearable medical and fitness appli­cations. The architecture combines ultra-low power, high-efficiency signal processing functionality and ease of use. An internal 96MHz oscillator provides high-performance capability, and the internal 4MHz oscillator supports minimal power consumption for applications requiring always-on monitoring. The device provides 512kB of flash and 160kB of SRAM.

The device features four powerful and flexible power modes. A peripheral management unit (PMU) enables intelligent peripheral control with up to six channels to significantly reduce power consumption. Built-in dynamic clock gating and firmware-controlled power gating allows the user to optimize power for the specific application.

Multiple SPI, UART, and I2C serial interfaces are pro­vided, as well as a 1-Wire® master and USB, allowing for interconnection to a wide variety of external sensors. A four-input, 10-bit delta-sigma ADC monitors analog input from external sensors. The MAX32625L is a lower-cost version of the MAX32625, providing 256kB of flash and 128kB of SRAM.

The MAX32626 is a secure version of the MAX32625. It incorporates a trust protection unit (TPU) with encryption and advanced security features. These features include a modular arithmetic accelerator (MAA) for ECDSA, a hardware TRNG entropy generator, and a secure boot loader. Both the MAX32626 and the MAX32625 provide a hardware AES engine.

MAX32625/MAX32626主要优势和特性:

High-Efficiency Microcontroller for Wearable DevicesInternal Oscillator Operates Up to 96MHz

Low Power 4MHz Oscillator System Clock Option for Always-On Monitoring Applications

512KB Flash Memory (256KB “L” Version)

160KB SRAM (128KB“L”Version)

8KB Instruction Cache

1.2V Core Supply Voltage

1.8V to 3.3V I/O

Optional 3.3V ±5% USB Supply Voltage

Wide Operating Temperature: -30℃ to +85℃

Power Management Maximizes Uptime for Battery Applications106μA/MHz Active Current Executing from Cache

49μA/MHz Active Current Executing from Flash

Wake-Up to 96MHz Clock or 4MHz Clock

600nA Low Power Mode (LP0) Current with RTC Enabled

2.56μW Ultra-Low Power Data Retention Sleep Mode (LP1) with Fast 5μs Wake-Up on 96MHz Clock Source

27μA/MHz Low Power Mode (LP2) Current

Optimal Peripheral Mix Provides Platform ScalabilitySPI Execute in Place (SPIX) Engine for Memory Expansion with Minimal Footprint

Three SPI Masters, One SPI Slave

Three UARTs

Up to Two I2C Masters, One I2C Slave

1-Wire Master

Full-Speed USB 2.0 Device with Internal Transceiver

Sixteen Pulse Train (PWM) Engines

Six 32-Bit Timers and 3 Watchdog Timers

Up to 40 General-Purpose I/O Pins

10-Bit Delta-Sigma ADC Operating at 7.8ksps

AES -128, -192, -256

CMOS-Level 32kHz RTC Output Available in All Power Modes

Secure Valuable IP and Data with Robust Internal Hardware Security (MAX32626 Only)Trust Protection Unit (TPU) Provides ECDSA and Modular Arithmetic Acceleration Support

True Random Number Generator

Secure Boot Loader

MAX32625/MAX32626应用:

Sports Watches

Fitness Monitors

Wearable Medical Patches

Portable Medical Devices

Sensor Hubs

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图1.MAX32625/MAX32626框图

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图2. MAX32625/MAX32626典型应用电路图

评估板MAX32625/MAX32626EVK

The MAX32625/MAX32626 evaluation kit (EV kit) pro­vides a convenient platform for evaluating the capabilities of the MAX32625/MAX32626 microcontroller. The EV kit also provides a complete, functional system ideal for developing and debugging applications.

评估板MAX32625/MAX32626EVK主要优势和特性:

Easily Load and Debug Code Using the Supplied Olimex ARM-USB-TINY-H JTAG Debugger Connected Through a Standard 20-Pin ARM JTAG Header

Selectable Power Sources for PMIC Include USB Power Through the CN1 or CN2 Connector, Optional External Battery Through J2 Connector, or Bench Supply Through Test Points TP8 and TP9

Selectable Power Source for On-Board Peripherals (Switches, LEDs, OLED Display, SPI Flash, Bluetooth® LE Transceiver)

Headers for Accessing the IC ’s I/O Pins and Analog Front End (AFE) Input Signals

USB Micro-B Connection to the IC’s USB Device Controller

USB Micro-B Connection to USB-UART Bridge Selectable Between the IC’s Internal UART 0 and UART 1

On-Board Bluetooth 4.0 BLE Transceiver with Chip Antenna

General-Purpose Pushbutton Switches and Indicator LEDs (All Connected to GPIOs) for User I/O

Prototyping Matrix (0.1in Grid) with Integrated Power Rails for Customer Circuitry

评估板MAX32625/MAX32626EVK包括:

EV kit board with a MAX32625 or MAX32626 micro­controller

Olimex ARM-USB-TINY-H JTAG debugger with JTAG ribbon cable (for connecting from debugger to EV kit header J1) and USB standard A-to-B cable (for con­necting from PC to debugger)

Standard-A to Micro-B USB cable (for connecting from PC or standalone USB power supply to EV kit USB Micro-B connector CN2) allows connection from PC USB host to the IC’s USB device controller peripheral

Standard-A to Micro-B USB cable (for connecting PC to EV kit USB connector CN1) allows virtual COM port interface to the IC’s UART 0 or UART 1 through a USB/UART bridge

MAX32625/MAX32626 EV Kit Quick Start Guide

Hex Keys for the Socket (MAX32626 EV Kit Only)

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图3.评估板MAX32625EVK套件外形图

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图4.评估板MAX32625/6EVK外形图

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图5.评估板MAX32625/6EVK框图

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图6.评估板MAX32625/6EVK电路图(1)

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图7.评估板MAX32625/6EVK电路图(2)

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图8.评估板MAX32625/6EVK电路图(3)

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图9.评估板MAX32625/6EVK电路图(4)

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图10.评估板MAX32625/6EVK电路图(5)

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

图11.评估板MAX32625/6EVK电路图(6)

评估板MAX32625/6EVK材料清单:

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

基于FPU的超低功耗高性能ARM MCU穿戴应用开发方案

声明:本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人,不代表电子发烧友网立场。文章及其配图仅供工程师学习之用,如有内容侵权或者其他违规问题,请联系本站处理。 举报投诉
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