电子发烧友App
TI公司的AM5749是高性别能Sitara ARM应用处理器，具有带Neon扩展的双核ARM Cortex-A15 RISC CPU和两个TIC66x VLIW浮点DSP核，集成了多达2.5MB L3 RAM，两个DDR3/DDR3L存储器接口（EMIF）模块，支持速率到DDR3-1333，多达2GB/EMIF，支持ECC/EMIF，主要用在工业通信，人机接口（HMI），自动化和控制，高性能应用以及其它通用应用。本文介绍了AM5749主要特性，框图，DDR3接口电路以及评估模块AM574x IDK框图，电路图，材料清单和PCB设计图。
AM574x Sitara Arm applications processors are built to meet the intense processing needs of modernembedded products.
AM574x devices bring high processing performance through the maximum flexibility of a fully integratedmixed processor solution. The devices also combine programmable video processing with a highlyintegrated peripheral set. Cryptographic acceleration is available in every AM574x device.
Programmability is provided by dual-core Arm Cortex-A15 RISC CPUs with Neon™ extension， and two TIC66x VLIW floating-point DSP cores. The Arm allows developers to keep control functions separate fromother algorithms programmed on the DSPs and coprocessors， thus reducing the complexity of the systemsoftware.
Additionally， TI provides a complete set of development tools for the Arm and C66x DSP， including Ccompilers， a DSP assembly optimizer to simplify programming and scheduling， and a debugging interfacefor visibility into source code execution.
Cryptographic acceleration is available in all devices. All other supported security features， includingsupport for secure boot， debug security and support for trusted execution environment are available onHigh-Security （HS） devices. For more information about HS devices， contact your TI representative.
AM5749主要特性：
• Dual Arm® Cortex®-A15 MicroprocessorSubsystem
• Up to two C66x Floating-Point VLIW DSP
– Fully Object-Code Compatible With C67x andC64x+
– Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle
• Up to 2.5MB of On-Chip L3 RAM
• Two DDR3/DDR3L Memory Interface （EMIF）Modules
– Supports rates up to DDR3-1333
– Up to 2GB Supported per EMIF
– ECC supported on primary EMIF
• 2× Dual Arm® Cortex®-M4 co-processors （IPU1and IPU2）
• Up to Two Embedded Vision Engines （EVEs）
• IVA-HD Subsystem
– 4K @ 15fps encode and decode support forH.264 CODEC
– Other CODECs are up to 1080p60
• Display Subsystem
– Full-HD Video （1920×1080p， 60 fps）
– Multiple Video Input and Video Output
– 2D and 3D Graphics
– Display Controller With DMA Engine and up toThree Pipelines
– HDMI™ Encoder： HDMI 1.4a and DVI 1.0Compliant
• 2× Dual-Core Programmable Real-Time Unit andIndustrial Communication Subsystem （PRU-ICSS）
• 2D-Graphics Accelerator （BB2D） Subsystem
– Vivante® GC320 Core
• Video Processing Engine （VPE）
• Dual-Core PowerVR® SGX544 3D GPU
• Secure Boot support
– Hardware-enforced Root-of-trust
– Customer programmable keys and OTP data
– Support for Takeover protection， IP protection，and anti-roll back protection
• Cryptographic Acceleration support
– Supports cryptographic cores
– AES – 128/192/256-bits key sizes
– 3DES – 56/112/168-bits key sizes
– MD5， SHA1
– SHA2 – 224/256/384/512
– True Random number generator
– DMA support
• Debug security
– Secure software controlled debug access
– Security aware debugging
• Trusted Execution Environment （TEE） support
– Arm TrustZone based TEE
– Extensive Firewall support for isolation
– Secure DMA path and interconnect
– Secure watchdog/timer/IPC
• Two Video Input Port （VIP） Modules
– Support for up to eight Multiplexed Input Ports
• General-Purpose Memory Controller （GPMC）
• Enhanced Direct Memory Access （EDMA）Controller
• 2-Port Gigabit Ethernet （GMAC）
• Sixteen 32-Bit General-Purpose Timers
• 32-Bit MPU Watchdog Timer
• Five Inter-Integrated Circuit （I2C） Ports
• HDQ™/ 1-Wire ® Interface
• Ten Configurable UART/IrDA/CIR Modules
• Four Multichannel Serial Peripheral Interfaces（McSPI）
• Quad SPI Interface （QSPI）
• SATA Gen2 Interface
• Eight Multichannel Audio Serial Port （McASP）Modules
• SuperSpeed USB 3.0 Dual-Role Device
• High-Speed USB 2.0 Dual-Role Device
• Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces （ MMC™/ SD™/SDIO）
• PCI Express® 3.0 Subsystems With Two 5-GbpsLanes
– One 2-lane Gen2-Compliant Port
– or Two 1-lane Gen2-Compliant Ports
• Up to two Controller Area Network （DCAN）Modules
– CAN 2.0B Protocol
• Modular Controller Area Network （MCAN） Module
– CAN 2.0B Protocol with available FD（Flexible Data Rate） functionality
• Up to 247 General-Purpose I/O （GPIO） Pins
• Power， Reset， and Clock Management
• On-Chip Debug With CTools Technology
• 28-nm CMOS Technology
• 23 mm × 23 mm， 0.8-mm Pitch， 760-Pin BGA（ABZ）
AM5749应用：
• Industrial Communication
• Human Machine Interface （HMI）
• Automation and Control
• High Performance Applications
• Other General Use
图1.AM5749框图
图2.采用两个16位DDR3器件32位一组DDR3接口电路图
图3.采用四个8位DDR3器件32位一组DDR3接口电路图
评估模块AM574x IDK
AM574x Industrial Development Kit （IDK） Evaluation Module （EVM）
The AM574x IDK is a standalone test， development， and evaluation module that enables developers towrite software and develop hardware for industrial control and industrial communications applications. Ithas been equipped with a TI AM5748 processor and a defined set of features to allow you to experienceindustrial communication solutions using various serial or Ethernet based interfaces. Using standardinterfaces， the AM574x IDK may interface to other processors or systems and act as a communicationgateway or controller. In addition， it can directly operate as a standard remote I/O system or a sensor connected to an industrial communication network.
The AM574x IDK contains embedded emulation circuitry to quickly enable developers to begin using thisIDK. The embedded emulation logic allows emulation and debug using standard development tools suchas the Texas Instruments Code Composer Studio™ integrated development environment （IDE） by simplyconnecting a USB cable to a Windows®-based computer.
The standard configuration for the AM574x IDK EVM provides the following Ethernet connectivity：
• Two Gigabit （1000Mb） metallic ports connected via PHY/RGMII to the on-chip Ethernet switch
• Two 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems
Reconfiguration through resistor removal and installation can provide an alternate Ethernet connectivity：
• Four 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems
Software support for the AM574x IDK EVM is provided within the Processor Software Development Kit（SDK） package. This includes both Linux and RTOS support.
图4.评估模块AM574x IDK外形图
图5.评估模块AM574x IDK外形图（背面）
图6.评估模块AM574x IDK框图
图7.评估模块AM574x IDK电路图（1）
图8.评估模块AM574x IDK电路图（2）
图9.评估模块AM574x IDK电路图（3）
图10.评估模块AM574x IDK电路图（4）
图11.评估模块AM574x IDK电路图（5）
图12.评估模块AM574x IDK电路图（6）
图13.评估模块AM574x IDK电路图（7）
图14.评估模块AM574x IDK电路图（8）
图15.评估模块AM574x IDK电路图（9）
图16.评估模块AM574x IDK电路图（10）
图17.评估模块AM574x IDK电路图（11）
图18.评估模块AM574x IDK电路图（12）
图19.评估模块AM574x IDK电路图（13）
图20.评估模块AM574x IDK电路图（14）
图21.评估模块AM574x IDK电路图（15）
图22.评估模块AM574x IDK电路图（16）
图23.评估模块AM574x IDK电路图（17）
图24.评估模块AM574x IDK电路图（18）
图25.评估模块AM574x IDK电路图（19）
图26.评估模块AM574x IDK电路图（20）
图27.评估模块AM574x IDK电路图（21）
图28.评估模块AM574x IDK电路图（22）
图29.评估模块AM574x IDK电路图（23）
图30.评估模块AM574x IDK电路图（24）
图31.评估模块AM574x IDK电路图（25）
图32.评估模块AM574x IDK电路图（26）
图33.评估模块AM574x IDK电路图（27）
图34.评估模块AM574x IDK电路图（28）
图35.评估模块AM574x IDK电路图（29）
图36.评估模块AM574x IDK电路图（30）
图37.评估模块AM574x IDK电路图（31）
图38.评估模块AM574x IDK电路图（32）
评估模块AM574x IDK材料清单：
图39.评估模块AM574x IDK PCB设计图（1）
图40.评估模块AM574x IDK PCB设计图（2）
图41.评估模块AM574x IDK PCB设计图（3）
图42.评估模块AM574x IDK PCB设计图（4）
图43.评估模块AM574x IDK PCB设计图（5）
图44.评估模块AM574x IDK PCB设计图（6）
图45.评估模块AM574x IDK PCB设计图（7）
图46.评估模块AM574x IDK PCB设计图（8）
图47.评估模块AM574x IDK PCB设计图（9）
图48.评估模块AM574x IDK PCB设计图（10）
图49.评估模块AM574x IDK PCB设计图（11）
图50.评估模块AM574x IDK PCB设计图（12）
图51.评估模块AM574x IDK PCB设计图（13）
图52.评估模块AM574x IDK PCB设计图（14）
图53.评估模块AM574x IDK PCB设计图（15）
图54.评估模块AM574x IDK PCB设计图（16）
图55.评估模块AM574x IDK PCB设计图（17）
图56.评估模块AM574x IDK PCB设计图（18）
图57.评估模块AM574x IDK PCB设计图（19）
图58.评估模块AM574x IDK PCB设计图（20）
图59.评估模块AM574x IDK PCB设计图（21）
详情请见：
和
am5749.pdf
工商网监
评论