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ST公司的ISM330DHCX是系统级封装 iNEMO惯性模块,具有机器学习内核,有限状态机(FSM)和数字输出.器件具有高性能3D数字加速度计和3D数字陀螺仪,特别为工业4.0应用而设计.ST公司的各种传感器元件采用特别的微机电技术制造,而IC接口采用CMOS技术,使得专用电路的设计能更好地和传感元件特性更好地匹配.ISM330DHCX 全范围加速度范围为±2/±4/±8/±16g,而角速率范围为±125/±250/±500/±1000/ ±2000/±4000dps,使得器件有广泛的应用。
ISM330DHCX无与伦比的嵌入特性(机器学习核,可编FSM,FIFO,传感器集线器,事件译码和中断)可以实现智能和复杂的传感器节点,以非常低的功耗提供高性能. ISM330DHCX采用14引脚LGA封装.模拟工作电压1.71 V到3.6 V,工作温度-40 到 +105 ℃ .主要用在工业IoT和连接设备,天线,平台,光学图像和透镜稳定.机器人,无线机和工业自动化,导航系统和远程信息处理,以及震动监视和补偿.中电网为您整理如下详细资料,本文介绍了ISM330DHCX主要特性,滤波器框图,加速度计复合滤波器框图,Mode 1/2/3&4的ISM330DHCX电连接图,加速度计框图以及评估板STEVAL-MKI210V1K主要特性,电路图和材料清单.
The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.
An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power. The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.
ISM330DHCX主要特性:
3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
Extended temperature range from -40 to +105 ℃
Embedded compensation for high stability over temperature
SPI/I²C serial interface
Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)
Six-channel synchronized output
Sensor hub feature to efficiently collect data from additional external sensors
Embedded smart FIFO up to 9 kbytes
Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors Machine Learning Core
Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
Embedded pedometer, step detector and counter for healthcare applications
Analog supply voltage: 1.71 V to 3.6 V
Embedded temperature sensor
Embedded self-test both for gyroscope and accelerometer
High shock survivability
ECOPACK, RoHS and “Green” compliant
ISM330DHCX应用:
Industrial IoT and connected devices
Antennas, platforms, and optical image and lens stabilization
Robotics, drones and industrial automation
Navigation systems and telematics
Vibration monitoring and compensation
ISM330DHCX片上特性:
9 kbytes data buffering, data can be compressed two or three times
– 100% efficiency with flexible configurations and partitioning
– Possibility to store timestamp
Event-detection interrupts (fully configurable):
– Free-fall
– Wakeup
– 6D orientation
– Click and double-click sensing
– Activity/inactivity recognition
– Stationary/Motion detection
Specific IP blocks with negligible power consumption and high-performance:
– Finite State Machine (FSM) for accelerometer, gyroscope, and external sensors
– Machine Learning Core (MLC)
– Significant Motion Detection, tilt, pedometer, step detector and step counters
Sensor hub
– Up to 6 total sensors: 2 internal (accelerometer and gyroscope) and 4 external sensors
图1.滤波器框图
图2.加速度计复合滤波器框图
图3.Mode 1的ISM330DHCX电连接图
图4.Mode 2的ISM330DHCX电连接图
图5.Mode 3和Mode 4的ISM330DHCX电连接图
图6.加速度计框图
评估板STEVAL-MKI210V1K
iNemo inertial module kit based on ISM330DHCX
The STEVAL-MKI210V1 evaluation board has an embedded ISM330DHCX 3D accelerometer and 3D gyroscope sensor, which is connected through flat cable to a simple adapter board (STEVAL-MKIGIBV2) to render it compatible with STEVALMKI109V3.
The sensor is soldered precisely in the center of the board and double-sidedadhesives are provided to allow users to conveniently mount the board on equipmentdestined for vibration analysis. Alternatively, you can mount the board using the holeslocated in each corner of the PCB.
The STEVAL-MKIGIBV2 can be plugged into a standard DIL 24 socket. The kitprovides the complete IIS3DWB pin-out and comes ready-to-use with the requireddecoupling capacitors on the VDD power supply line.
This adapter is supported by the STEVAL-MKI109V3 motherboard with highperformance 32-bit microcontroller functioning as a bridge between the sensor and aPC, on which it is possible to use the downloadable graphical user interface (UnicoGUI), or dedicated software routines for customized applications.
评估板STEVAL-MKI210V1K主要特性:
• User friendly ISM330DHCX board
• Complete ISM330DHCX pinout for a standard DIL 24 socket
• Double-sided adhesives included for easy mounting on equipment to bemeasured
• Fully compatible with and STEVAL-MKI109V3 motherboard
• RoHS compliant
图7.评估板STEVAL-MKI210V1K外形图
图8.评估板STEVAL-MKI210V1电路图
图9.评估板STEVAL-MKI210V2电路图
评估板STEVAL-MKI210V1K材料清单:
评估板STEVAL-MKI210V1材料清单:
评估板STEVAL-MKI210V2材料清单:
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