--- 产品详情 ---
Sample rate (Max) (MSPS) | 1800, 3600 |
Resolution (Bits) | 12 |
Number of input channels | 2, 1 |
Interface type | Parallel LVDS |
Analog input BW (MHz) | 2800 |
Features | Ultra High Speed |
Rating | Catalog |
Input range (Vp-p) | 0.8 |
Power consumption (Typ) (mW) | 4180 |
Architecture | Folding Interpolating |
SNR (dB) | 58.6 |
ENOB (Bits) | 9.4 |
SFDR (dB) | 73 |
Operating temperature range (C) | -40 to 85 |
Input buffer | Yes |
- Configurable to Either 3.6 GSPS Interleaved or 1.8?GSPS Dual ADC
- Pin-Compatible with ADC10D1000/1500 and ADC12D1000/1600
- Internally Terminated, Buffered, Differential Analog Inputs
- Interleaved Timing Automatic and Manual Skew Adjust
- Test Patterns at Output for System Debug
- Programmable 15-bit Gain and 12-bit Plus Sign Offset
- Programmable tAD Adjust Feature
- 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
- AutoSync Feature for Multi-Chip Systems
- Single 1.9-V ± 0.1-V Power Supply
- Key Specifications
- Resolution: 12 Bits
- Interleaved 3.6 GSPS ADC
- Noise Floor Density –153.5 dBm/Hz (typ)
- IMD3 –61 dBFS (typ)
- Noise Power Ratio 48.5 dB (typ)
- Power 4.4 W (typ)
- Full Power Bandwidth 1.75 GHz (typ)
- Dual 1.8 GSPS ADC, Fin = 125MHz
- ENOB: 9.4 (typ)
- SNR 58.5 dB (typ)
- SFDR 73 dBc (typ)
- Power 4.4 W (typ)
- Full Power Bandwidth 2.8 GHz (typ)
The 12-bit, 3.6 GSPS ADC12D1800 is the latest advance in TI?s Ultra-High-Speed ADC family and builds upon the features, architecture and functionality of the 10-bit GHz family of ADCs.
The ADC12D1800 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common mode voltage.
The product is packaged in a leaded or lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to +85°C.
To achieve full rated performance for fCLK > 1.6 GHz, write the maximum power settings one time to Register 6h through the serial interface; see Section 5.6.1 for more information.
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