| Technology Family | AUP |
| Supply voltage (Min) (V) | 0.8 |
| Supply voltage (Max) (V) | 3.6 |
| Number of channels (#) | 1 |
| IOL (Max) (mA) | 4 |
| IOH (Max) (mA) | -4 |
| ICC (Max) (uA) | 10 |
| Input type | Standard CMOS |
| Output type | 3-State |
| Features | Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs |
| Rating | Catalog |
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- Available in the Texas Instruments NanoStar? Package
- Low Static-Power Consumption
- ICC = 0.9 μA Maximum
- Low Dynamic-Power Consumption
- Cpd = 4.2 pF at 3.3 V Typical
- Low Input Capacitance
- CI = 1.5 pF Typical
- Low Noise – Overshoot and Undershoot
<10% of VCC - Input-Disable Feature Allows Floating Input Conditions
- Ioff Supports Partial Power-Down-Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.7 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
The AUP family is TI?s premier solution to the industry?s low power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family ).
This buffer/driver is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals.
To assure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
NanoStar? package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
