在物联网电路板设计中实现最佳无线通信性能

　　在物联网电路板设计中实现最佳无线通信性能

　　技术创新是加快和物联网（IoT）吸收发展，至少不是“片上系统”（SOC）设计，结合微控制器（MCU）和无线连接。现代SoC授权设计师提供高性能网络和获得新的制度设计，市场比以往任何时候都更快、更便宜地。

　　产品设计者必须最大限度地提高无线通信性能-无论他们使用的协议-确保他们的射频（RF）电路和电路板布局进行了全面优化。

　　This is no easy task， because the RF signals you want to send and receive probably won’t be the only ones present： switching power supplies or the MCU clock， for example， can also generate RF signals. Bad design can hamper the device’s communication range， or require higher-power transmission to compensate. In battery-powered devices， the second option has the undesired effect of shortening battery life. Moreover， transmitting at higher power may create false signals， which can interfere with other devices or fall foul of regulatory requirements.

　　This is why product makers need to understand some key enablers of good wireless communication， as well as the way their circuit layouts can affect these enablers. This article will look at some best practices that will help designers deliver optimal RF performance from their products. Throughout the piece， we’ll make reference to a circuit board layout to house the EFR32 Wireless Gecko SoC from Silicon Labs.