Recommendations for Board Asse

The CanPAK is a near chipscale metal‐shielded package with an exposed die surface on the bottom (see Figure 1). The metal can forms the drain connection of the package and has two connections that are soldered to the PCB during the board‐mounting process. The can acts as a heat spreader and also protects the die from mechanical damage. The drain contact of the die is connected to the interior of the can with a conductive adhesive. The die surface is protected by a passivation layer to avoid mechanical damage; this layer also defines the wettable surfaces of source and gate pads. The pads
are pre‐soldered to aid the board mounting soldering process. There are no unnecessary packaging elements to contribute to higher thermal and electrical inductance, and resistance. Therefore the CanPAK’s power capabilities exceed those of other comparably sized packages.