可测性设计的介绍

1 Introduction to Design for Testability 1-1
2 Reasons for Using Design for Testability -1
The Need for Testability ..-2
Test-Time Cost ..-2
Time-to-Market ..-3
Fault Coverage and Cost of Ownership-5
3 Developing a Testability Strategy 3-1
Selecting a Technology.3-2
Committing to Testability Design Practices3-3
Establishing a Fault-Grade Requirement...3-4
Will IEEE Standard 1149.1 Be a System Requirement? 3-5
Selecting a Testability Approach Based on Gate Density.3-6
Choosing Structured Tools ....3-7
Establishing a Diagnostic Pattern Set to Expedite Debug3-9
Generating High-Fault-Grade Test Patterns ....3-10
Simulating Test Patterns and Timing 3-11
Converting Test Patterns to TDL ......3-12
Planning for Test Pattern/Logic Revision Compatibility 3-13
4 Test Pattern Requirements 4-1
Responsibilities4-2
TDL Type Descriptions .4-3
5 Ad Hoc Testability Practices 5-1
Logic Design With Testability in Mind .5-2
Improving Testability Via Unused Pins ......5-3
Using Bidirectional Pins5-4
Initializing the Circuit to a Known State .....5-5
Avoiding Asynchronous Circuitry.5-7
Avoiding Gated Clocks .5-8
Allowing Internal Clocks to Be Bypassed From Circuit’s Inputs....5-9
Allowing Counters and Dividers to Be Bypassed ..5-10
Splitting Long Counter Paths.....5-11
Multiplexing to Provide Direct Access to Logic 5-12
Breaking Feedback Paths in Nested Sequential Circuits5-14
Allowing Redundant Circuitry to Be Tested .....5-15
Watching for Signals That Reconverge ...5-16
Decoupling Linked Logic Blocks5-17
Johnson Counter Test Signal Generator .5-18
Shift Register Test Signal Generator 5-19
Shift Register Used to Obtain Observability ....5-20
6 Structured Testability Practices 6-1
Structured Approaches to Designing for Testability .6-2
Clocked Scan Flip-Flop Design ...6-3
Multiplexed Flip-Flop Scan Design .....6-5
Clock Skew and Edge-Triggered Flip-Flop Scan .....6-7
Clocked LSSD Scan Flip-Flop Design6-8
Guidelines for Flip-Flop Scan Design ......6-10
Scan Path Loading on Critical ac Path ....6-11
Bus Contention and Scan Testing ....6-12
Test-Isolation Modules6-14
Where Scan Is Not Efficient.6-20
7 IEEE Standard 1149.1-1990 7-1
Overview..7-2
Boundary-Scan Architecture .7-3
8 Generic Test Access Port 8-1
Overview..8-2
Test Register....8-3
Test Register—Bit Definitions .....8-5
Controller ..8-7
Communication Protocol 8-8
9 Parallel Module Test 9-1
Parallel Module Test of MegaModules9-2
MegaModule Test Collar.9-4
Single MegaModule PMT I/O Hookup 9-5
PMT Test Bus ..9-6
Multiple MegaModule PMT I/O Hookup.....9-7
PMT for Analog MegaModules ....9-9
In-System Use .....9-21
10 Parametric Measurements 10-1
Overview.10-2
Input Threshold Voltage Levels Using a Clocked NAND Tree (VIH_VIL TDL Type) ....10-4
Output Voltage Levels (DC_PARA TDL Type) .....10-10
Three-State High-Impedance Measurements (DC_PARA TDL Type) ...10-11
Input Current Measurements (DC_PARA TDL Type) .10-12
Quiescent Drain Supply Current (IDDQ TDL Type) ....10-13
11 Automatic Test Pattern Generation 11-1
Introduction to Automatic Test Pattern Generation 11-2
Path Sensitization 11-5
Full-Scan Designs ......11-6
Partial-Scan Designs ..11-7
Testing and Debugging Considerations ...11-8
Common ATPG Constraints 11-9
Summary .....11-10
12 Test Pattern Generation 12-1
Introduction to Testing 12-2
Test Pattern Creation..12-6
TDL Overview....12-13
13 IEEE Standard 1149.1-Based dc Parametric Testing 13-1
Introduction....13-2
Boundary-Scan Architecture .....13-3
Parametric Measurements Using Boundary-Scan Architecture ......13-10
Integrating Boundary-Scan Architecture and GTAP ...13-18
14 Military ASIC 14-1
Military-Specific Design Information .14-2
Military ASIC Topics Cross-Reference ....14-3
Glossary 1
Index Index-1