资料介绍
The EL1503A ADSL Line Driver contains two wideband
high-voltage drivers which are ideally suited for both ADSL
and HDSL2 applications. They can supply a 39.2VP-P signal
into a 22Ω load while exhibiting very low distortion. The
EL1503A also has a number of power saving features. The
IADJ pin can be used to set the maximum supply current and
the C0 and C1 pins can be used to digitally vary the supply
current to one of four modes. These modes include full
power, low power, terminate only and power down.
The EL1503A uses current-feedback type amplifiers, which
achieve a high slew rate while consuming moderate power.
They retain their frequency response over a wide range of
externally set gains. The EL1503A operates on ±5V to ±12V
supplies and consumes only 12.5mA per amplifier.
The device is supplied in a thermally-enhanced 20 Ld SOIC
(0.300”) and the small footprint (4x5mm) 24 Ld QFN
packages. Center pins on each side of the 20 Ld and 16 Ld
packages are used as ground connections and heat
spreaders. The QFN package has the potential for a low θJA
(<40°C/W) and dissipates heat by means of a thermal pad
that is soldered onto the PCB. All package options are
specified for operation over the full -40°C to +85°C
high-voltage drivers which are ideally suited for both ADSL
and HDSL2 applications. They can supply a 39.2VP-P signal
into a 22Ω load while exhibiting very low distortion. The
EL1503A also has a number of power saving features. The
IADJ pin can be used to set the maximum supply current and
the C0 and C1 pins can be used to digitally vary the supply
current to one of four modes. These modes include full
power, low power, terminate only and power down.
The EL1503A uses current-feedback type amplifiers, which
achieve a high slew rate while consuming moderate power.
They retain their frequency response over a wide range of
externally set gains. The EL1503A operates on ±5V to ±12V
supplies and consumes only 12.5mA per amplifier.
The device is supplied in a thermally-enhanced 20 Ld SOIC
(0.300”) and the small footprint (4x5mm) 24 Ld QFN
packages. Center pins on each side of the 20 Ld and 16 Ld
packages are used as ground connections and heat
spreaders. The QFN package has the potential for a low θJA
(<40°C/W) and dissipates heat by means of a thermal pad
that is soldered onto the PCB. All package options are
specified for operation over the full -40°C to +85°C
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