Cree XLamp®优化LED PCB的热性能

　　Cree XLamp®优化LED PCB的热性能

　　1。介绍

　　这个设计笔记概述协助开发成本有效的热管理XP和XLamp LED MX家庭技术。

　　LED照明系统中最关键的设计参数之一是该系统能够将热量从LED接点中分离出来。LED连接处的高工作温度对发光二极管的性能产生不利影响，导致光输出和寿命缩短1。为了正确地管理这种热量，照明应用中LED的设计、组装和操作应遵循特定的做法。

　　本应用说明概述了一种设计低成本印刷电路板（PCB）布局的技术，它优化了LED的热量传递。该技术涉及使用的多氯联苯的FR-4为基础，成本较低，但比金属芯印刷电路板（MCPCB）更大的热阻。使用金属内衬孔或通孔的下面是一个LED的散热垫散热通过fr-4-pcb和成适当的散热方法。

　　Using metalized vias is a technique available to the LED packaging used by Cree XLamp LEDs. Electrically isolated thermal pads are a requirement for using this technique. For certain illumination systems design， thermal vias enable the use of FR-4 circuit boards over metal core circuit boards. This can deliver system cost savings in circuit board and heat sink selection.

　　This application note serves as a practical guideline based on heat transfer fundamentals and includes suggestive， but not definitive， simulation and measurement data. Cree advocates this technique as appropriate design for certain lighting applications and encourages Cree’s customers to evaluate this option in considering the many thermal management techniques available. For additional guidelines on LED thermal management refer to application note， Cree XLamp LED Thermal Management.